RF-WM-3200B3

RF-WM-3200B3 模塊是 RF-Star 推出的一款完全兼容 TI 官方 CC3200MOD 的嵌入式 Wi-Fi模塊，具有業(yè)界最低的待機(jī)功耗；該模塊采用 TI Simple-Link Wi-Fi CC3200 芯片設(shè)計(jì)，內(nèi)置高性能 ARM Cortex-M4 處理器，包含多種外設(shè)，如：并行攝像頭接口，I2S，SD/MMC，UART， SPI，I2C，ADC 和 GPIO。模塊支持 IEEE 802.11 b/g/n 無線標(biāo)準(zhǔn)，支持 Station，AP 和 Wi-Fi 直連模式。模塊采用了寬電壓 Flash W25Q80BL，模塊供電電壓范圍從 2.3V 到 3.6V，可以使用電池供電。

核心方案： CC3200
支持協(xié)議： IEEE 802.11 b/g/n
發(fā)射功率： +17dBm
通信距離： 100m
核心優(yōu)勢(shì)：功耗低兼容TI320MOD

無線通信方案廠商

實(shí)測(cè)功耗

從不以理論值代替實(shí)際值宣傳

無線通信方案廠商

模塊可在STA模式建立TCP連接

作為Client與遠(yuǎn)端服務(wù)器連接通信

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模塊可在STA模式建立TCP Server

并與其他Internet設(shè)備連接通信

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模塊可在AP模式建立TCP Server

其他Wi-Fi設(shè)備在STA模式TCP Client與之相互通信

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原廠可替換

可直接替換原廠CC3200MOD

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支持低功耗

優(yōu)化后可以將Wi-Fi節(jié)點(diǎn)的續(xù)航提升至12個(gè)月無線通信方案廠商

應(yīng)用場(chǎng)景

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機(jī)械尺寸

引腳定義

腳位	名稱	功能	備注
Pin1	GND	-	Ground
Pin2	GND	-	Ground
Pin3	GPIO10	I/O	GPIO
Pin4	GPIO11	I/O	GPIO
Pin5	GPIO14	I/O	GPIO
Pin6	GPIO15	I/O	GPIO
Pin7	GPIO16	I/O	GPIO
Pin8	GPIO17	I/O	GPIO
Pin9	GPIO12	I/O	GPIO
Pin10	GPIO13	I/O	GPIO
Pin11	GPIO22	I/O	GPIO
Pin12	JTAG_TDI	I/O	JTAG TDI input. Leave unconnected if not used on product
Pin13	FLASH_SPI_MISO	I	External Serial Flash Programming: SPI data in
Pin14	FLASH_SPI_nCS_IN	I	External Serial Flash Programming: SPI chip select (active low)
Pin15	FLASH_SPI_CLK	I	External Serial Flash Programming: SPI clock
Pin16	GND	-	Ground
Pin17	FLASH_SPI_MOSI	O	External Serial Flash Programming: SPI data out
Pin18	JTAG_TDO	I/O	JTAG TDO output. Leave unconnected if not used on product
Pin19	GPIO28	I/O	GPIO
Pin20	NC	-	-
Pin21	JTAG_TCK	I/O	JTAG TCK input. Leave unconnected if not used on product.(2) An internal 100 kΩ pull down resistor is tied to this pin.
Pin22	JTAG_TMS	-	JTAG TMS input. Leave unconnected if not used on product.
Pin23	SOP2	-	An internal 100 kΩ pull down resistor is tied to this SOP pin. An external 10 kΩ resistor is required to pull this pin high. See Section 6.11.1 for SOP[2:0] configuration modes.
Pin24	SOP1	-	An internal 100 kΩ pull down resistor is tied to this SOP pin. An external 10 kΩ resistor is required to pull this pin high. See Section 6.11.1 for SOP[2:0] configuration modes.
Pin25	GND	-	Ground
Pin26	GND	-	Ground
Pin27	GND	-	Ground
Pin28	GND	-	Ground
Pin29	GND	-	Ground
Pin30	GND	-	Ground
Pin31	RF_ABG	I/O	Ground
Pin32	GND	-	Ground
Pin33	NC	-	-
Pin34	SOP0		An internal 100 kΩ pull down resistor is tied to this SOP pin. An external 10 kΩ resistor is required to pull this pin high. See Section 6.11.1 for SOP[2:0] configuration modes.
Pin35	nRESET	I	There is an internal, 100 kΩ, pull-up resistor option from the nRESET pin to VBAT_RESET. Note: VBAT_RESET is not connected to VBAT1 or VBAT2 within the module. The following connection schemes are recommended: • Connect nRESET to a switch, external controller, or host, only if nRESET will be in a defined state under all operating conditions. Leave VBAT_RESET unconnected to save power. • If nRESET cannot be in a defined state under all operating conditions, connect VBAT_RESET to the main module power supply (VBAT1 and VBAT2). Due to the internal pullup resistor a leakage current of 3.3 V / 100 kΩ is expected.
Pin36	VBAT_RESET	-
Pin37	VBAT1	Power	Power supply for the module, must be connected to battery (2.3 V to 3.6 V)
Pin38	GND	-	Ground
Pin39	NC	-	-
Pin40	VBAT2	Power	Power supply for the module, must be connected to battery (2.3 V to 3.6 V)
Pin41	NC	-	-
Pin42	GPIO30		GPIO
Pin43	GND		Ground
Pin44	GPIO30
Pin45	NC	-	-
Pin46	GPIO1	I/O	GPIO
Pin47	GPIO2	I/O	GPIO
Pin48	GPIO3	I/O	GPIO
Pin49	GPIO4	I/O	GPIO
Pin50	GPIO5	I/O	GPIO
Pin51	GPIO6	I/O	GPIO
Pin52	GPIO7	I/O	GPIO
Pin53	GPIO8	I/O	GPIO
Pin54	GPIO9	I/O	GPIO
Pin55	GND	-	Thermal ground
Pin56	GND	-	Thermal ground
Pin57	GND	-	Thermal ground
Pin58	GND	-	Thermal ground
Pin59	GND	-	Thermal ground
Pin60	GND	-	Thermal ground
Pin61	GND	-	Thermal ground
Pin62	GND	-	Thermal ground
Pin63	GND	-	Thermal ground