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  • New developed Nordic nRF52840 BLE 5.0 module

    2018-09-02 13:48:24 信馳達(dá)科技

    l Overview

    These Bluetooth modules are BLE RF modules. With advantages of low power consumption, compact design, long transmission distance and strong anti-interference capability, the modules embedded with high performance IFA, can be widely used in low power local area network communication.

    RF-BM-ND05 built upon chip Nordic52840. The module can be used to develop consumer electronic products and phone peripherals over BLE 5.0. It provide a  quick BLE solution for the communication between customer’s products to mobile devices.


     
     
     
     


    l Module Parameters

    SoC

    nRF52840QIAA

    Supply Voltage

    1.7V ~ 5.5V,3. 3V will be recommended

    Frequency

    2400 MHz ~ 2483.5MHz

    Tx Power

    -20dBm ~ +8dBm

    Sensitivity

    -96 dBm

    Frequency Error

    ±20 kHz

    FLASH

    1MB

    RAM

    256KB

    Operating Temperature Range

    -20℃ ~ +70℃
    (Chip support -40℃~+85℃,can adjust the working temperature by change the crystal)

    Storage Temperature Range

    -40℃ ~ +125℃

    Module Size

    24.8*15.0*2.3mm

     

     
     

    Pin assignment

     
     
    Figure 1 Pin assignment
     

    Pin

    Name

    Definition

    Remarks

    Pin1

    GND

    Ground

    Ground

    Pin2

    VCC

    Positive Input

    Power Supply: 3.3V

    Pin3

    P21

    I/O


    Pin4

    P22

    I/O


    Pin5

    P23

    I/O


    Pin6

    P24

    I/O


    Pin7

    P25

    I/O


    Pin8

    P28

    I/O


    Pin9

    P29

    I/O


    Pin10

    P30

    I/O


    Pin11

    P26

    I/O


    Pin12

    P27

    I/O


    Pin13

    P02

    I/O


    Pin14

    P03

    I/O


    Pin15

    P04

    I/O


    Pin16

    P05

    I/O


    Pin17

    P06

    I/O


    Pin18

    P07

    I/O


    Pin19

    P08

    I/O


    Pin20

    P09

    I/O


    Pin21

    P10

    I/O


    Pin22

    P11

    I/O


    Pin23

    P12

    I/O


    Pin24

    P13

    I/O


    Pin25

    P14

    I/O


    Pin26

    P15

    I/O


    Pin27

    P16

    I/O


    Pin28

    SWDIO


    Pin29

    SWCLK


    Pin30

    P17

    I/O


    Pin31

    P18

    I/O


    Pin32

    P19

    I/O


    Pin33

    P20

    I/O



    Package Size

    Thickness of the module is 2.3 ± 0.1 mm
     
     
    Figure 2 Package Size


    Layout Proposals

    The serpentine antenna on PCB is free space electromagnetic radiation. The place and layout range are keys to enhance the data rate and transmit range.

    ThusBelow are the layout proposals for antenna and route:

    1, Place the antenna on the edge(corner) of the PCB backplane.

    2, Make sure there is no signal or copper foil in each layer.

    3, Hollowing out the yellow pane part (figure 3) to make less S11 interference.


     
    Figure 3
     

    Recommended Operating Conditions

    Notes

    (1) The operating temperature is limited to the change of crystal’s frequency.

    (2) To ensure the RF performance, the ripple wave of the source must be less than 300mV.

    Identification

    Test Condition

    Min

    Typ

    Max

    Unit

    Source & IO

    Battery mode

    1.6

    3.3

    5.5

    V

    Operating Temperature

    /

    -20

    25

    70

    Environmental Hot Pendulum


    -20


    20

    ℃/Min

     

    Reflow Conditions

    1. Heating modeconventional convection or IR convection;

    2. Times allowed to reflow: 2 times, for the below reflow (conditions)figure 4);

    3. Temperature curve: the reflow should be in accordance with the temperature curve shown below (figure 4)

    4. Highest245°C。
     

    Figure 4 Parts’ heat-resistance temperature curve for welding(welding point

     

     
    Electrostatic Discharge
     

    Module will be damaged for the discharge of static, RF star suggest that all modules should follow the 3 precautions below.:

    1. According to the anti-static measures, bare hands are not allowed to touch modules.

    2. Modules must be placed in anti- static areas.

    3. Take the anti-static circuitry(when inputting HV or VHF) into consideration in product design. Static may result in the degradation in performance of module, even causing the failure.


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